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Chromium+etchant
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Chromium+etchant
Supplier:
Transene
Description:
Silver Etchant TFS is a fast etchant for silver films. Excellent photoresist compatibility.
Supplier:
Transene
Description:
Copper Etchant 49-1 is a highly selective, moderate etch rate copper etchant. Will not attack photoresist or other metals, including nickel.
Supplier:
Transene
Description:
Wright Etchant is the classic defect delineation etchant for silicon semiconductor substrates.
Supplier:
Transene
Description:
Copper Etchant CE-100 is a fast etch for removal of thicker copper films.
Supplier:
Transene
Description:
Nickel Etchant TFB is an effective general purpose etchant for sputtered or evaporated pure nickel films.
Supplier:
Transene
Description:
Nichrome Etchant TFN is an effective etchant for Ni-Cr thin films in integrated circuits. Good photoresist compatibilty.
Supplier:
Thermo Scientific Chemicals
Description:
Applications: Iron (III) chloride solution for immersion etching copper, copper alloys and Kovar in printed circuit board applications
Catalog Number:
(AA42110-K7)
Supplier:
Thermo Scientific Chemicals
Description:
Etchant Solution, Ce (IV) concentration 0.25N,UN3093,Liquid,DANGER: CORROSIVE, burns skin and eyes,1L,4L,CORROSIVE,OXIDIZER
Supplier:
Transene
Description:
Gold Etchant GE-8148 is a faster gold etchant designed to minimize attack on nickel. Excellent photoresist compatibility.
Catalog Number:
(RCR4250000100A)
Supplier:
Transene
Description:
Buffered Oxide Etchant 10:1 with surfactant is a slower-speed etchant for oxide films. 10:1 ratio of ammonium fluoride: HF. Contains non-PFAS surfactant to improve wet-out of high surface energy substrates or penetration of critical geometries.
Supplier:
Transene
Description:
Buffered Oxide Etchant 6:1 with surfactant is a moderate-speed etchant for oxide films. 6:1 ratio of ammonium fluoride: HF. Contains non-PFAS surfactant to improve wet-out of high surface energy substrates or penetration of critical geometries.
Supplier:
Transene
Description:
Gold Etchant TFA is a general purpose etchant for etching fine lines in gold thin films. Excellent photoresist compatibility. Suitable for gold bump processing. Gold Etchant TFA also etches nickel.
Catalog Number:
(89400-770)
Supplier:
KMG
Description:
Wet chemical etching is an integral part of semiconductor manufacturing process. KMG’s line of ultra etchants (BOE w/surfactant) offers a variety of silicon dioxide etching rates and characteristics to meet your processing needs.
Supplier:
Ansell Healthcare
Description:
These hand-specific, powder-free gloves are made from 100% natural latex polymer, which offers good protection from a wide spectrum of acids, etchants, and solvents.
Supplier:
Transene
Description:
Buffered Oxide Etchant 6:1 is a moderate-speed etchant for oxide films. 6:1 ratio of ammonium fluoride: HF.
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 is still displayed and you need assistance, please call us at 1-800-932-5000.
Stock for this item is limited, but may be available in a warehouse close to you. Please make sure that you are logged in to the site so that available stock can be displayed. If the
is still displayed and you need assistance, please call us at 1-800-932-5000.
This product is marked as restricted and can only be purchased by approved Shipping Accounts. If you need further assistance, email VWR Regulatory Department at Regulatory_Affairs@vwr.com
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The original product is no longer available. The replacement shown is available.
This product is no longer available. Alternatives may be available by searching with the VWR Catalog Number listed above. If you need further assistance, please call VWR Customer Service at 1-800-932-5000.
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